Tetrabond™ Plus
Tetrabond™ Plus is a macro-particle free, non-hydrogenated diamond like carbon (DLC) film with a micro hardness of more than 5000 HV. It is applied in a thickness range from 0.5 to 3.0 µm using an enhanced arc technology process with deposition temperatures below 300 °C. The most common application of Tetrabond™ Plus is the coating of cutting tools for non ferrous materials, e.g.:
- Aluminium
- Graphite
- Copper
- Titanium (certain grades)
- PCB boards
- Composite materials
- Plastics
- Epoxies
- Wood
Advantages of Tetrabond™ Plus ta-C coatings:
- Sharp edges are maintained
- Complex tool designs can be coated, including advanced chip breaker designs
- Depth of cut is not limited to the length of the diamond segment, as is the case for PCD tools
- Tetrabond™ Plus can be coated on HSS and carbide tools
- The tools can be reground, making the best use of expensive cutting tools
