Tetrabond™ Plus

Tetrabond™ Plus is a macro-particle free, non-hydrogenated diamond like carbon (DLC) film with a micro hardness of more than 5000 HV. It is applied in a thickness range from 0.5 to 3.0 µm using an enhanced arc technology process with deposition temperatures below 300 °C. The most common application of Tetrabond™ Plus is the coating of cutting tools for non ferrous materials, e.g.:

  • Aluminium
  • Graphite
  • Copper
  • Titanium (certain grades)
  • PCB boards

  • Composite materials
  • Plastics
  • Epoxies
  • Wood

Advantages of Tetrabond Plus ta-C coatings:

  • Sharp edges are maintained
  • Complex tool designs can be coated, including advanced chip breaker designs
  • Depth of cut is not limited to the length of the diamond segment, as is the case for PCD tools
  • Tetrabond Plus can be coated on HSS and carbide tools
  • The tools can be reground, making the best use of expensive cutting tools